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Indium 8.9 Lead-Free SAC305 Solder Paste
Indium 8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium 8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium 8.9 minimizes false failures in ICT.Read more
Indium NC-SMQ92J Solder Paste
NC-SMQ92J is a halide-free, air reflow, no-clean solder paste formulated to leave a benign, probe-testable residue. The residue is easily penetrated and will not clog multi-point probes. This product offers consistent fine-pitch paste deposition, unsurpassed stencil life and tack time, and excellent wetting. NC-SMQ92J will perform well on high speed surface mount lines utilizing fast print speeds and rapid chip placement. NC-SMQ92J meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria.Read more
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